Onto Innovation stands alone in process control with our unique perspective across the semiconductor value chain. We enable our customers to solve their most difficult yield, device performance, quality, and reliability issues. Onto Innovation will optimize customers’ critical path of progress by making them smarter, faster and more efficient. Headquartered in Wilmington, Massachusetts, Onto Innovation supports its customers with a worldwide sales and service organization.

Innovative Process Solutions for Customers

We combine the scale of a global leader with an expanded portfolio of leading-edge technologies that include: unpatterned wafer quality; 3D metrology spanning the chip from nanometer-scale transistors to micron-level die-interconnects; macro defect inspection of wafers and packages; metal interconnect composition; factory analytics; and lithography for advanced semiconductor packaging. The breadth of this portfolio allows us to collaborate with customers about their process yields and process variations from bare silicon wafers through the wafer fab to the final back-end packaging. Onto Innovation’s software brings understanding of how individual processes affect the overall product, enabling customers to improve product quality and reliability.

Growing Addressable Markets

Onto Innovation is expanding its addressable markets using R&D innovations to leverage existing product technologies that serve adjacent markets. There are currently three key initiatives to expand our addressable market in various phases of development.

  • Bare Wafer Inspection Market ($400 million TAM, $50 million SAM): We introduced our first product to silicon foundries (bare wafer manufacturers) in Q4 2018 and immediately began accepting orders for our NovusEdge macro inspection system. These new customers are providing the raw silicon material needed by semiconductor manufacturers to fabricate functioning chips in their wafer fab facilities. The NovusEdge system allows the bare wafer suppliers to sort and select the wafers with the highest edge and back-side characteristics for their semiconductor customers that are utilizing the most stringent fab processes. This product is rapidly becoming the tool of record for four of the top five global wafer suppliers, which allows these new customers to differentiate their products for the most discerning semiconductor fabs.
  • Industrial Surface Measurement Market ($200 - $400 million SAM): We entered this market as a result of the technology acquisition of 4D Technology’s Dynamic Interferometry® solutions, which are used in a variety of industries to provide accurate shape and surface measurement data, which provides feedback to customers of optical quality, machine finish, and surface defects, to improve manufacturing yield and performance. Our products primarily serve the aerospace and defense markets, and “Portable 3D Profilers” which serve aviation, automotive and industrial precision machining (e.g. blades, rollers, additive manufacturing) markets.
  • High Definition Mobile Flat Panel Display Market ($500 million SAM): We are leveraging our JetStep X700 lithography technology that serves the semiconductor fan-out panel level packaging (FOPLP) application to create an innovative solution for ultra-high definition mobile displays. This new lithography tool is targeted for the emerging Gen 6 flat panel size, using two lenses to simultaneously create images on the panel’s photoresist layer that will ultimately form the backplane layer of the display. The features needed for ultra-high definition mobile displays far exceed the requirements for 4K TV, for example. The extremely small pixels on these displays require lithographic technology combined with the ability to cover a very large panel measuring approximately 1.5 meters x 2 meters.
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Top Four US Wafer Fab Equipment Supplier

Onto Innovation’s combined revenues for wafer fab equipment place the company as the fourth largest US supplier and 15th worldwide. This size/scale defines a supplier to the industry that supports customer innovation strategies with adequate R&D resources to be a key partner of innovation. At the same time, the company has a large team of customer support engineers to collaborate with customers on future plans as well as solid support for existing products.

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Strong and highly motivated leadership team

CEO Mike Plisinski has over 27 years of experience in semiconductor capital equipment. He successfully completed the merger between Rudolph Technologies and Nanometrics to form the fourth largest semiconductor capital equipment supplier in the US. His recent accomplishments at the CEO of Rudolph Technologies included doubling the shareholder value and four consecutive record revenue years.

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